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Proceedings Paper

Characterization of (near) hermetic zero-level packages for MEMS
Author(s): Piet De Moor; Kris Baert; Ingrid De Wolf; Anne Jourdain; Harrie A. C. Tilmans; Ann Witvrouw; Chris A. Van Hoof
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Paper Abstract

Zero-level packaging, i.e. the encapsulation of the MEMS device at wafer level, is an essential technique for MEMS miniaturization and cost reduction. A large number of different capping and sealing materials and techniques can be used. However, the testing and qualification of this type of packaging of MEMS devices requires special techniques. A number of conventional and new characterization techniques for mechanical and hermeticity testing are presented, as well as an overview about outgasing measurements and reliability testing.

Paper Details

Date Published: 22 January 2005
PDF: 10 pages
Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); doi: 10.1117/12.596190
Show Author Affiliations
Piet De Moor, IMEC (Belgium)
Kris Baert, IMEC (Belgium)
Ingrid De Wolf, IMEC (Belgium)
Anne Jourdain, IMEC (Belgium)
Harrie A. C. Tilmans, IMEC (Belgium)
Ann Witvrouw, IMEC (Belgium)
Chris A. Van Hoof, IMEC (Belgium)

Published in SPIE Proceedings Vol. 5716:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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