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Proceedings Paper

Use of microchannel cooling for high-power two-dimensional laser diode arrays
Author(s): Rushikesh M. Patel; David K. Wagner; Allen D. Danner; Kambiz Fallahpour; Richard S. Stinnett
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Paper Abstract

A significant challenge for achieving higher average power two-dimensional diode lasers lies in effectively removing the enormous heat flux generated by these devices. Packaging based on microchannel cooling offers a practical means of addressing the thermal management problem. Microchannel coolers are capable of extracting high heat fluxes ( > 60 Watts/cm2) while maintaining a highly uniform surface temperature. These coolers require less than 0.5 1pm coolant flow and operate with nearly constant thermal impedance over a range of 10 to 50 psig fluid pressure. State-of the -art performance of two-dimensional arrays mounted on microchannel plates confirm the thermal characteristics of the coolers. The thermal impedance of the entire package (cooling fluid to diode junction) is less than 0.33 °C.cm2/W. Arrays exceeding 1500 W peak power at duty cycle of 2% routinely exhibit less than 4 nm bandwidth with accurate control of center wavelength.

Paper Details

Date Published: 26 June 1992
PDF: 9 pages
Proc. SPIE 1634, Laser Diode Technology and Applications IV, (26 June 1992); doi: 10.1117/12.59178
Show Author Affiliations
Rushikesh M. Patel, Applied Solar Energy Corp. (United States)
David K. Wagner, Applied Solar Energy Corp. (United States)
Allen D. Danner, Applied Solar Energy Corp. (United States)
Kambiz Fallahpour, Applied Solar Energy Corp. (United States)
Richard S. Stinnett, Applied Solar Energy Corp. (United States)

Published in SPIE Proceedings Vol. 1634:
Laser Diode Technology and Applications IV
Daniel S. Renner, Editor(s)

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