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Proceedings Paper

EMC problems in microelectronic sensor packaging
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Paper Abstract

Microelectronics for environmental monitoring (microsensors, etc.) present a variety of power supply voltages and operative frequencies from one side and are subject to interference and noise from the external environment on the other. All these aspects lead accuracy and reliability of those circuits devoted to physical measurements a difficult compromise for the designer. Sensors implemented in the newest generation of networks are realized by integrating advanced analog features with digital processing capabilities. The analog blocks, above all, where the processing related to the signal provided by the active element is performed, show in the most substantial way this problem related to EMC inadequacy. In order to restore the top-quality features it is necessary to arrange the best shielding design for the blocks more influenced by interference and noise. So the work of the designer leads to the analysis, simulation and realization of localized and global shields inside and on the packaging. The problem related to the definition of EMC role in designing such shields is very substantial for environmental applications, where performance leads to improve and optimize the traditional designing techniques. The proposal and consequent application of general criteria devoted to define specific needs for shielding is the first step of a logical development oriented to the mature industrial production of efficient and reliable devices able to maintain their performance independently by the influence of external and internal noise.

Paper Details

Date Published: 23 February 2005
PDF: 5 pages
Proc. SPIE 5650, Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II, (23 February 2005); doi: 10.1117/12.582371
Show Author Affiliations
Alessandro Gandelli, Politecnico di Milano (Italy)
Francesco Grimaccia, Politecnico di Milano (Italy)
Marco Mussetta, Politecnico di Milano (Italy)
Riccardo Enrico Zich, Politecnico di Milano (Italy)

Published in SPIE Proceedings Vol. 5650:
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II
Jung-Chih Chiao; David N. Jamieson; Lorenzo Faraone; Andrew S. Dzurak, Editor(s)

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