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Proceedings Paper

Optimization of film thickness for thermoelectric micro-Peltier cooler
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Paper Abstract

In this paper, the design of a thin film thermoelectric microcooler module is examined. The module consists of n-type bismuth telluride and p-type antimony telluride thermoelectric materials. The commercial software CFD-ACE+ is used to implement and analyse the model. A two-dimensional coupled electrical and thermal synthesis was performed. The influence of the thickness of the thermoelectric materials on the change in temperature has been investigated. The thickness of the thermoelements was varied between 0.5 and 20 μm. The device performance in terms of change in temperature with and without a load has been studied. The optimal thickness for the thermoelements was found to be 2μm. At 30mA, a temperature difference of 3K below ambient was obtained.

Paper Details

Date Published: 28 February 2005
PDF: 8 pages
Proc. SPIE 5649, Smart Structures, Devices, and Systems II, (28 February 2005); doi: 10.1117/12.582256
Show Author Affiliations
Sasikaran Kandasamy, RMIT Univ. (Australia)
Damien Pachoud, RMIT Univ. (Australia)
David A. Powell, RMIT Univ. (Australia)
Kourosh Kalantar-zadeh, RMIT Univ. (Australia)
Gary Rosengarten, RMIT Univ. (Australia)
Melbourne Univ. (Australia)
Anthony Stephen Holland, RMIT Univ. (Australia)
Wojtek Wlodarski, RMIT Univ. (Australia)

Published in SPIE Proceedings Vol. 5649:
Smart Structures, Devices, and Systems II
Said F. Al-Sarawi, Editor(s)

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