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Proceedings Paper

Manufacture of large-scale mechanical devices in single-crystal silicon by high-speed grinding
Author(s): S. T. Smith; Derek G. Chetwynd; D. Jackson
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Paper Abstract

Preliminary studies have been performed on small beams of silicon (1 X 6 X 40 mm) diamond machined by high speed milling/grinding. The effect of the grinding on the strength of these specimens has been assessed by masking a small portion of the surface and etching in a 1:9 solution of hydrofluoric and nitric acids for a set time. Removal of the mask reveals a step which is measured to determine the amount of material removed from the surface. These are then examined using x-ray diffractometry and the etch step surface finish measured using a Rank Taylor Hobson Form Talysurf stylus profilometer. Finally, the strength of the specimens is measured by loading the beams to failure in a small three point bend testing machine and monitoring the failure load. There is a slight increase in strength between the as-ground specimen and those where the surface has been etched by 1 - 2 micrometers . Both x-ray and stylus measurements indicate the presence of a surface layer of thickness of the order one micrometer that is likely to be due to ductile mode grinding. It is also noted that there appears to be a local peak in strength after approximately 2 - 3 micrometers has been etched from the surface. This is followed by a small reduction before steadily increasing to a maximum value of 425 MPa. It is speculated that this could be a result of a low defect zone around the tips of the cracks that are invariably propagated during the grinding process.

Paper Details

Date Published: 1 April 1992
PDF: 9 pages
Proc. SPIE 1573, Commercial Applications of Precision Manufacturing at the Sub-Micron Level, (1 April 1992); doi: 10.1117/12.57744
Show Author Affiliations
S. T. Smith, Univ. of Warwick (United Kingdom)
Derek G. Chetwynd, Univ. of Warwick (United Kingdom)
D. Jackson, Univ. of Warwick (United Kingdom)

Published in SPIE Proceedings Vol. 1573:
Commercial Applications of Precision Manufacturing at the Sub-Micron Level
Lionel R. Baker, Editor(s)

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