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Proceedings Paper

Ion beam milling of fused silica for window fabrication
Author(s): Scott R. Wilson; David W. Reicher; C. F. Kranenberg; John Robert McNeil; Patricia L. White; Peter M. Martin; David E. McCready
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Paper Abstract

Ion beam figuring has been demonstrated to be a deterministic efficient flexible technique for removing material from optical surfaces. Recent interest in using this process to produce high quality optical components has driven the need to fully characterize the resulting surfaces. We have performed a polishing parameter matrix investigation to optimize fused silica (Corning 7957) surfaces for subsequent ion milling. Samples were characterized for surface scatter surface absorption surface roughness subsurface damage and laser damage as a function of mill depth. Small defects (pits) were evident on surfaces after milling a few microns with pit density dependent to some degree upon the surface preparation technique. The defects were often in lines apparently following a surface or subsurface scratch in the materiaL Surface scatter decreased significantly (up to lOX) and laser damage threshold increased in some cases by 400. Laser damage was not correlated with defects in the material. Key words: ion beam milling laser damage scatter fused silica absorption. 1.

Paper Details

Date Published: 1 June 1991
PDF: 5 pages
Proc. SPIE 1441, Laser-Induced Damage in Optical Materials: 1990, (1 June 1991); doi: 10.1117/12.57219
Show Author Affiliations
Scott R. Wilson, Univ. of New Mexico (United States)
David W. Reicher, Univ. of New Mexico (United States)
C. F. Kranenberg, Univ. of New Mexico (United States)
John Robert McNeil, Univ. of New Mexico (United States)
Patricia L. White, Pacific Northwest Lab. (United States)
Peter M. Martin, Pacific Northwest Lab. (United States)
David E. McCready, Pacific Northwest Lab. (United States)

Published in SPIE Proceedings Vol. 1441:
Laser-Induced Damage in Optical Materials: 1990
Harold E. Bennett; Lloyd L. Chase; Arthur H. Guenther; Brian Emerson Newnam; M. J. Soileau, Editor(s)

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