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Proceedings Paper

Continuous-slope phase-shift transition
Author(s): Anton K. Pfau; Edward W. Scheckler; David M. Newmark; Andrew R. Neureuther
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Paper Abstract

The general application of phase-shift mask technology often requires special features accommodating a non printing transition from 0° to 180°. Transitions featuring a continuous slope exhibit reduced linewidth variation and smaller intensity dips as compared to step transitions employing intermediate phase-shift levels. In this paper we report on a method for forming continuous slope phase- shift transitions using ion milling. A slope was created as a result of a locally variable etch time caused by changing the tilt angle of the mask plate during the etching. Thus, steady progress of the resist shadow along the etched region by controlled adjustment of the tilt angle defined the transition profile. The experimental results were reproduced by simulation including the effects of source rotation.

Paper Details

Date Published: 1 January 1992
PDF: 9 pages
Proc. SPIE 1604, 11th Annual BACUS Symposium on Photomask Technology, (1 January 1992); doi: 10.1117/12.56953
Show Author Affiliations
Anton K. Pfau, Univ. of California/Berkeley (United States)
Edward W. Scheckler, Univ. of California/Berkeley (United States)
David M. Newmark, Univ. of California/Berkeley (United States)
Andrew R. Neureuther, Univ. of California/Berkeley (United States)

Published in SPIE Proceedings Vol. 1604:
11th Annual BACUS Symposium on Photomask Technology
Kevin C. McGinnis, Editor(s)

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