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Proceedings Paper

Hybrid integration platform for planar lightwave subsystems
Author(s): Louay Eldada
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Paper Abstract

We report on a hybrid organic/inorganic platform that allows the integration of passive and active optical functions to form planar lightwave subsystems. The integration approaches include chip-to-chip attach, flip-chip mounting, and insertion of films in slots formed in optical waveguiding circuitry. The materials integrated include polymer, silica, silicon, silicon oxynitride, lithium niobate, indium phosphide, gallium arsenide, yttrium iron garnet, and neodymium iron boron. The functions enabled by the hybrid integration approaches span the range of building blocks needed in optical circuitry, while using the highest-performance material system for each function. We demonstrate a number of subsystems on a chip, including fully reconfigurable optical add/drop multiplexers and tunable optical transmitters.

Paper Details

Date Published: 20 December 2004
PDF: 15 pages
Proc. SPIE 5577, Photonics North 2004: Optical Components and Devices, (20 December 2004); doi: 10.1117/12.567609
Show Author Affiliations
Louay Eldada, DuPont Photonics Technologies (United States)

Published in SPIE Proceedings Vol. 5577:
Photonics North 2004: Optical Components and Devices
John C. Armitage; Simon Fafard; Roger A. Lessard; George A. Lampropoulos, Editor(s)

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