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Proceedings Paper

In-situ characterization of SiO2 deposition and growth for gate-oxides
Author(s): Michael Liehr
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Paper Abstract

The use of Si02 gate oxides with thicknesses of <100A will put stringent requirements on the control of contamination during device manufacturing. It has been realized only recently that control of molecular contamination is as important for critical device films as control of particulates. We present in this paper an investigation of challenges of thin gate oxides, possible alternative oxide deposition schemes, and control of foreign molecular species. using an ultra-clean, integrated processing system with in-situ analysis capabilities. In particular, the interfacial region of thermal gate oxides is investigated, as well as the chemical vapor deposition of oxides from SiH4 and 02 , and the incorporation of fluorine into gate oxides.

Paper Details

Date Published: 1 February 1992
PDF: 11 pages
Proc. SPIE 1595, Rapid Thermal and Integrated Processing, (1 February 1992); doi: 10.1117/12.56673
Show Author Affiliations
Michael Liehr, IBM/Thomas J. Watson Research Ctr. (United States)

Published in SPIE Proceedings Vol. 1595:
Rapid Thermal and Integrated Processing
Mehrdad M. Moslehi; Rajendra Singh; Dim-Lee Kwong, Editor(s)

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