Intrinsic and extrinsic limitations on conventional top-emitting high-speed VCSEL modulation bandwidth are discussed. A new VCSEL structure has been designed with reduced constraints on modulation bandwidth. The structure simultaneously addresses the primary extrinsic factors that limit the VCSEL modulation bandwidth. The new bottom-emitting, flip-chipped VCSEL structure improves heat-sinking, current injection uniformity, and reduces parasitic capacitance. We estimate the ultimate bandwidth of this new structure to be as high as 40Gb/s.

Date Published: 4 November 2004
PDF: 7 pages
Proc. SPIE 5556, Photonic Devices and Algorithms for Computing VI, (4 November 2004); doi: 10.1117/12.558041

Published in SPIE Proceedings Vol. 5556:
Photonic Devices and Algorithms for Computing VI
Khan M. Iftekharuddin; Abdul Ahad S. Awwal, Editor(s)