
Proceedings Paper
Bottom-emitting flip-chip VCSEL structure with reduced constraints on modulation responseFormat | Member Price | Non-Member Price |
---|---|---|
$17.00 | $21.00 |
Paper Abstract
Intrinsic and extrinsic limitations on conventional top-emitting high-speed VCSEL modulation bandwidth are discussed. A new VCSEL structure has been designed with reduced constraints on modulation bandwidth. The structure simultaneously addresses the primary extrinsic factors that limit the VCSEL modulation bandwidth. The new bottom-emitting, flip-chipped VCSEL structure improves heat-sinking, current injection uniformity, and reduces parasitic capacitance. We estimate the ultimate bandwidth of this new structure to be as high as 40Gb/s.
Paper Details
Date Published: 4 November 2004
PDF: 7 pages
Proc. SPIE 5556, Photonic Devices and Algorithms for Computing VI, (4 November 2004); doi: 10.1117/12.558041
Published in SPIE Proceedings Vol. 5556:
Photonic Devices and Algorithms for Computing VI
Khan M. Iftekharuddin; Abdul Ahad S. Awwal, Editor(s)
PDF: 7 pages
Proc. SPIE 5556, Photonic Devices and Algorithms for Computing VI, (4 November 2004); doi: 10.1117/12.558041
Show Author Affiliations
Ahmad N. Al-Omari, Colorado State Univ. (United States)
Stewart A. Feld, Colorado State Univ. (United States)
Stewart A. Feld, Colorado State Univ. (United States)
Kevin L. Lear, Colorado State Univ. (United States)
Published in SPIE Proceedings Vol. 5556:
Photonic Devices and Algorithms for Computing VI
Khan M. Iftekharuddin; Abdul Ahad S. Awwal, Editor(s)
© SPIE. Terms of Use
