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Proceedings Paper

Correlation of inspection methods in characterizing nanomachined photomask repairs
Author(s): Jeffrey E. Csuy; Ron R. Bozak; Lee Terrill; Roy White; Naoki Nishida
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Paper Abstract

Nanomachining has become a mainstream process for repairing photomasks. The advantages of nanomachining versus other repair techniques are improved edge placement, reliable depth control, and minimized substrate damage. This technique can be applied to any defect that requires a subtractive repair process. The process can be equally well applied to defects of any material including unknown materials. This paper evaluates the correlation of different inspection methods in characterizing nanomachined photomask repairs. The repairs were made using an nm650 mask repair tool manufactured by RAVE LLC. The repairs were inspected using a 248nm Aerial Image Measurement System (AIMS) and the Atomic Force Microscope (AFM) image produced by the nanomachining tool itself. These repairs were performed on 248nm MoSi photomasks. Results were compared to measurements by SEM and optical edge placement measurement techniques.

Paper Details

Date Published: 20 August 2004
PDF: 9 pages
Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); doi: 10.1117/12.557736
Show Author Affiliations
Jeffrey E. Csuy, RAVE LLC (United States)
Ron R. Bozak, RAVE LLC (United States)
Lee Terrill, RAVE LLC (United States)
Roy White, RAVE LLC (United States)
Naoki Nishida, HOYA Corp. (Japan)


Published in SPIE Proceedings Vol. 5446:
Photomask and Next-Generation Lithography Mask Technology XI
Hiroyoshi Tanabe, Editor(s)

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