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Proceedings Paper

3D heterogeneous sensor system on a chip for defense and security applications
Author(s): Shekhar Bhansali; Glenn H. Chapman; Eby G. Friedman; Yehea Ismail; P. R. Mukund; Dennis Tebbe; Vijay K. Jain
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Paper Abstract

This paper describes a new concept for ultra-small, ultra-compact, unattended multi-phenomenological sensor systems for rapid deployment, with integrated classification-and-decision-information extraction capability from a sensed environment. We discuss a unique approach, namely a 3-D Heterogeneous System on a Chip (HSoC) in order to achieve a minimum 10X reduction in weight, volume, and power and a 10X or greater increase in capability and reliability -- over the alternative planar approaches. These gains will accrue from (a) the avoidance of long on-chip interconnects and chip-to-chip bonding wires, and (b) the cohabitation of sensors, preprocessing analog circuitry, digital logic and signal processing, and RF devices in the same compact volume. A specific scenario is discussed in detail wherein a set of four types of sensors, namely an array of acoustic and seismic sensors, an active pixel sensor array, and an uncooled IR imaging array are placed on a common sensor plane. The other planes include an analog plane consisting of transductors and A/D converters. The digital processing planes provide the necessary processing and intelligence capability. The remaining planes provide for wireless communications/networking capability. When appropriate, this processing and decision-making will be accomplished on a collaborative basis among the distributed sensor nodes through a wireless network.

Paper Details

Date Published: 1 September 2004
PDF: 12 pages
Proc. SPIE 5417, Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI, (1 September 2004); doi: 10.1117/12.548199
Show Author Affiliations
Shekhar Bhansali, Univ. of South Florida (United States)
Glenn H. Chapman, Simon Fraser Univ. (Canada)
Eby G. Friedman, Univ. of Rochester (United States)
Yehea Ismail, Northwestern Univ. (United States)
P. R. Mukund, Rochester Institute of Technology (United States)
Dennis Tebbe, Harris Corp. (United States)
Vijay K. Jain, Univ. of South Florida (United States)

Published in SPIE Proceedings Vol. 5417:
Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI
Edward M. Carapezza, Editor(s)

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