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Proceedings Paper

New thermally isolated pixel structure for high-resolution uncooled infrared FPAs
Author(s): Shigeru Tohyama; Masaru Miyoshi; Seiji Kurashina; Nobukazu Ito; Tokuhito Sasaki; Akira Ajisawa; Naoki Oda
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Paper Abstract

This paper proposes a new thermally isolated pixel structure, having a twice-bent beam structure and eaves structure, suitable for high-resolution uncooled infrared (IR) focal-plane arrays (FPAs). It also describes the properties of test devices, fabricated to verify the effect of the new pixel structure. Although the pixel size of the test devices is 23.5 μm × 23.5 μm, which represents a smaller area by a factor of about 2.5 than the 37 μm × 37 μm pixel size for the 320 × 240 bolometer-type uncooled IRFPA, previously developed by the authors, the test devices have beams with almost the same length as in the previous IRFPA by utilizing the new beam structure. In addition, the cross-sectional area of the beam is reduced. Accordingly, the thermal conductance of the test devices can be reduced by a factor of about 2.5. The eaves structure, which is adopted to increase the fill factor of pixels, improves the responsivity by a factor of 1.3, which is consistent with our calculations. By utilizing the new thermally isolated pixel structure, the test devices with 23.5 μm pixels enable us to achieve thermal sensitivity equivalent to the previous 37 μm pixels.

Paper Details

Date Published: 30 August 2004
PDF: 9 pages
Proc. SPIE 5406, Infrared Technology and Applications XXX, (30 August 2004); doi: 10.1117/12.548145
Show Author Affiliations
Shigeru Tohyama, NEC Corp. (Japan)
Masaru Miyoshi, NEC Corp. (Japan)
Seiji Kurashina, NEC Glass Components Ltd. (Japan)
Nobukazu Ito, NEC Corp. (Japan)
Tokuhito Sasaki, NEC Corp. (Japan)
Akira Ajisawa, NEC Corp. (Japan)
Naoki Oda, NEC Corp. (Japan)

Published in SPIE Proceedings Vol. 5406:
Infrared Technology and Applications XXX
Bjorn F. Andresen; Gabor F. Fulop, Editor(s)

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