Share Email Print

Proceedings Paper

Hybrid analysis of micromachined silicon thin film based on digital microscopic holography
Author(s): Lei Xu; Xiaoyuan Peng; Jianmin Miao; Anand Krishna Asundi
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Thin films are the elementary structures in many MEMS devices. Their applications can be found vastly in micromachined silicon pressure sensors. With respect to the specific demands in thin film analysis for microstructures, we present a hybrid approach integrating digital microscopic holographic measurement with finite element analysis in this paper for high-resolution full-field characterization of the micromachined silicon thin film. The pressure-induced membrane deflections are accurately measured with the developed system, and serve as reliable reference data to verify the FE model, which is then applied for strain and stress calculation and sensitivity characterization.

Paper Details

Date Published: 17 August 2004
PDF: 8 pages
Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); doi: 10.1117/12.546600
Show Author Affiliations
Lei Xu, Nanyang Technological Univ. (Singapore)
Xiaoyuan Peng, Nanyang Technological Univ. (Singapore)
Jianmin Miao, Nanyang Technological Univ. (Singapore)
Anand Krishna Asundi, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 5458:
Optical Micro- and Nanometrology in Manufacturing Technology
Christophe Gorecki; Anand K. Asundi, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?