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Proceedings Paper

Flip-chip assembly and reliability using gold/tin solder bumps
Author(s): Hermann Oppermann; Matthias Hutter; Matthias Klein; Herbert Reichl
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Paper Abstract

Au/Sn solder bumps are commonly used for flip chip assembly of optoelectronic and RF devices. They allow a fluxless assembly which is required to avoid contamination at optical interfaces. Flip chip assembly experiments were carried out using as plated Au/Sn bumps without prior bump reflow. An RF and reliability test vehicles comprise a GaAs chip which was flip chip soldered on a silicon substrate. Temperature cycling tests with and without underfiller were performed and the results are presented. The different failure modes for underfilled and non-underfilled samples were discussed and compared. Additional reliability tests were performed with flip chip bonding by gold thermocompression for comparison. The test results and the failure modes are discussed in detail.

Paper Details

Date Published: 8 September 2004
PDF: 10 pages
Proc. SPIE 5454, Micro-Optics: Fabrication, Packaging, and Integration, (8 September 2004); doi: 10.1117/12.546463
Show Author Affiliations
Hermann Oppermann, Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (Germany)
Matthias Hutter, Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (Germany)
Matthias Klein, Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (Germany)
Herbert Reichl, Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration (Germany)

Published in SPIE Proceedings Vol. 5454:
Micro-Optics: Fabrication, Packaging, and Integration
Peter Van Daele; Juergen Mohr, Editor(s)

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