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Proceedings Paper

3D analysis of defects in integrated circuits by one-photon optical-beam-induced current imaging and laser confocal reflectance microscopy
Author(s): Jelda Jayne Miranda; Caesar Saloma
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Paper Abstract

Three-dimensional analysis is performed on defects found in an integrated circuit from high-contrast images that are obtained via an inexpensive technique that combines confocal reflectance microscopy with one-photon optical beam-induced current (1P-OBIC) imaging. The same focused beam simultaneously produces the 1P-OBIC and reflectance signals from the illuminated spot. Exclusive 3D distributions of the metal and semiconductor sites in the vicinity of defects caused by electrical overstress (decrease in OBIC current) and unwanted formation of generation centers (increase in OBIC current), reveal features which are difficult to isolate with confocal or 1P-OBIC microscopy alone.

Paper Details

Date Published: 4 December 2003
PDF: 7 pages
Proc. SPIE 5255, Biomolecular Photonics and Multidimensional Microscopy, (4 December 2003); doi: 10.1117/12.546234
Show Author Affiliations
Jelda Jayne Miranda, Univ. of the Philippines (Philippines)
Caesar Saloma, Univ. of the Philippines (Philippines)

Published in SPIE Proceedings Vol. 5255:
Biomolecular Photonics and Multidimensional Microscopy
Qingming Luo; Min Gu, Editor(s)

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