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Proceedings Paper

Optical contacts to waveguides in printed circuit boards
Author(s): Torsten Rupp; Oleksandr Shkarban; Arnd Menschig
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Paper Abstract

The development of printed circuit boards (PCB) with integrated layers for optical data transfer was pushed during the last few years. Solutions with optical fibers or planar waveguides fabricated from plastics or glass will soon be available on the market. Nevertheless the low loss coupling of functional optical components as connectors, transmitters and receivers to these new generations of PCBs still is open. The packaging of otical transceivers or connectors actually is based mainly on single device solutions or active coupling concepts. On the other side the connectors of external optical data lines or of daughter cards to the main boards and the coupling of transmitter and receiver modules to optical PCBs do need linear array concepts. And the coupling efficiency should not decrease during reflow process. Actual concepts using mulit-mode connectors or a direct waveguide coupling of receivers suffer under high optical losses. However the use of micro-optical functional elements allows the realization of coupling concepts with teh lowest losses possible. The total losses for optical lines from the transmitter to the waveguide and back to the receiver can be reduced below 4 dB. For cost reduction even symmetric optical set-up can be used. The transmission rate can be as high as 40 Gb/s. With this concept error tolerant systems for the optical interconnection are possible. We report about the modeling, the design and the characterization of micro-optical interconnect modules for high efficient contacts to the optical layer in PCBs. For the assembly of the modules we use the new concept of a desk-top factory with miniaturized tools for handling, assembly, and inspection. This concept increases the flexibility and reduces the manufacturing costs.

Paper Details

Date Published: 8 September 2004
PDF: 5 pages
Proc. SPIE 5453, Micro-Optics, VCSELs, and Photonic Interconnects, (8 September 2004); doi: 10.1117/12.545593
Show Author Affiliations
Torsten Rupp, MiLaSys technologies GmbH (Germany)
Oleksandr Shkarban, MiLaSys technologies GmbH (Germany)
Arnd Menschig, MiLaSys technologies GmbH (Germany)

Published in SPIE Proceedings Vol. 5453:
Micro-Optics, VCSELs, and Photonic Interconnects
Hugo Thienpont; Kent D. Choquette; Mohammad R. Taghizadeh, Editor(s)

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