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Proceedings Paper

Planar waveguide microlenses for nonblocking photonic switches and optical interconnects
Author(s): Alexei L. Glebov; Lidu Huang; Michael Lee; Shigenori Aoki; Kishio Yokouchi
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Paper Abstract

Different types of planar waveguide microlenses are fabricated with PLC technologies from a variety of optical materials such as silica, photo-definable epoxy resins, and a number of other optical polymers. Hybrid microlenses are also fabricated in which the base of the lens, with a double concave gap, is formed from silica and the gap is filled with an optical polymer. The optimized lens structures provide the maximum coupling efficiencies between the input and output channels at distances up to 100 mm with a minimum channel pitch of 0.5-0.7 mm. Experimental and theoretical studies provide results on collimation and focusing properties of single and double microlenses made of silica, polymer, and silica/polymer. The evaluation of the temperature and wavelength effects on the collimation characteristics of the lenses demonstrate that the single lenses are more stable and, thus, more suitable for operations under varying conditions. Examples of the planar waveguide microlens applications are presented. In one application the microlens arrays are integrated in fast electrooptic photonic switching modules. In the other application the microlenses are embedded in the backplanes with nonblocking optical interconnects.

Paper Details

Date Published: 8 September 2004
PDF: 10 pages
Proc. SPIE 5453, Micro-Optics, VCSELs, and Photonic Interconnects, (8 September 2004); doi: 10.1117/12.545180
Show Author Affiliations
Alexei L. Glebov, Fujitsu Labs. of America, Inc. (United States)
Lidu Huang, Fujitsu Labs. of America, Inc. (United States)
Michael Lee, Fujitsu Labs. of America, Inc. (United States)
Shigenori Aoki, Fujitsu Labs. of America, Inc. (United States)
Kishio Yokouchi, Fujitsu Labs. of America, Inc. (United States)

Published in SPIE Proceedings Vol. 5453:
Micro-Optics, VCSELs, and Photonic Interconnects
Hugo Thienpont; Kent D. Choquette; Mohammad R. Taghizadeh, Editor(s)

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