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Proceedings Paper

Correlating reticle pinhole defects to wafer printability for the 90-nm node lithography using advanced RET
Author(s): W. B. Shieh; William Chou; Chuen-Huei Yang; J. K. Wu; Noah Chen; Shih Ming Yen; Tony Hsu; Steve Tuan; Doris Chang; Maciej W. Rudzinski; Lantian Wang; Kong Son
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Paper Abstract

For the 90nm-lithography node, understanding the impact of various reticle pinhole defects on wafer printability is essential to optimize wafer yield and to create the best quality reticle defect specification. In this study, a new programmed pinhole test reticle was designed by UMC, TCE and KLA-Tencor based on UMC's process requirements for its 193nm lithography. The reticle was manufactured and inspected on KLA-Tencor's high-resolution reticle inspection system in die to database mode by TCE. The reticle was then printed on a wafer by UMC to characterize the printability impact of programmed pinhole defects. The programmed pinhole test reticle, "193PTM", consists of two IC background patterns - poly gate and contact with programmed pinholes at various locations. The pinhole size ranges from 20nm to 75nm in 5nm increments on the wafer. By comparing the high-resolution pattern inspection results to the wafer print data, we have established the correlation and the appropriate mask specifications based on wafer application guidelines.

Paper Details

Date Published: 28 May 2004
PDF: 12 pages
Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); doi: 10.1117/12.544243
Show Author Affiliations
W. B. Shieh, United Microelectronics Corp. (Taiwan)
William Chou, United Microelectronics Corp. (Taiwan)
Chuen-Huei Yang, United Microelectronics Corp. (Taiwan)
J. K. Wu, United Microelectronics Corp. (Taiwan)
Noah Chen, United Microelectronics Corp. (Taiwan)
Shih Ming Yen, United Microelectronics Corp. (Taiwan)
Tony Hsu, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Steve Tuan, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Doris Chang, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Maciej W. Rudzinski, KLA-Tencor Corp. (United States)
Lantian Wang, KLA-Tencor Corp. (United States)
Kong Son, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 5377:
Optical Microlithography XVII
Bruce W. Smith, Editor(s)

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