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Proceedings Paper

High-power UV laser machining of silicon wafers
Author(s): Tom M. Corboline; Edward C. Rea Jr.; Corey M. Dunsky
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Paper Abstract

As the demand for semiconductor devices based upon ever-thinner silicon substrates continues to increase, mechanical techniques suitable for dicing wafers appear to be approaching their practical limits. Recent advances in power scaling have now enabled reliable ultraviolet-wavelength lasers to be considered to offer a flexible solution to this dilemma. This paper presents new data on the machining of thin silicon wavers using a high average power 355-nm wavelength pulsed laser. In particular, the concept of pulse repetition-rate scaling of the effective cutting speeds was investigated to determine the preferred direction for further laser development efforts.

Paper Details

Date Published: 18 November 2003
PDF: 6 pages
Proc. SPIE 5063, Fourth International Symposium on Laser Precision Microfabrication, (18 November 2003); doi: 10.1117/12.540931
Show Author Affiliations
Tom M. Corboline, Coherent, Inc. (United States)
Edward C. Rea Jr., Coherent, Inc. (United States)
Corey M. Dunsky, Coherent, Inc. (United States)

Published in SPIE Proceedings Vol. 5063:
Fourth International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Andreas Ostendorf; Koji Sugioka; Henry Helvajian, Editor(s)

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