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Proceedings Paper

High-aspect-ratio neural probes for monolithic integration with ultra-low-power CMOS operational amplifier circuit
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Paper Abstract

A microprobe array for recording neural signals has been designed and fabricated for future monolithic integration with an ultra-low power CMOS operational amplifier circuit on a 2 mm × 2 mm chip. A LIGA-like process is employed utilizing UV lithography and electrodeposition techniques. Probes are fabricated on silicon substrate. The fabrication process is compatible with monolithic integration with CMOS signal processing circuitry. The probes are 210 um high and have an aspect ratio 3:1. Comments are made on processing issues related to chip-level monolithic integration.

Paper Details

Date Published: 29 July 2004
PDF: 6 pages
Proc. SPIE 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, (29 July 2004); doi: 10.1117/12.539593
Show Author Affiliations
Tinghui Xin, Louisiana State Univ. (United States)
Pratul K. Ajmera, Louisiana State Univ. (United States)
Chuang Zhang, Louisiana State Univ. (United States)
Ashok Srivastava, Louisiana State Univ. (United States)


Published in SPIE Proceedings Vol. 5389:
Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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