Share Email Print
cover

Proceedings Paper

Initial assessment of the lithographic impact of the use of a hard pellicle on wafer distortion
Author(s): Michael K. Kocsis; Peter De Bisschop; Richard Bruls; Andrew Grenville; Chris Van Peski
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Due to the short life span of soft pellicles at the 157nm wavelength, hard pellicles are currently considered the primary option for reticle protection. The hard pellicle is an 800μm thick fused silica plate, which while protecting the reticle surface from particles, will also act as an optical element in the exposure system and cause unwanted aberrations. This paper specifically explores the hard pellicle’s impact on image distortion. We present and validate a methodology to predict pellicle induced wafer distortion based upon the pellicle shape as measured using an interferometer. Overlay results using hard pellicle A to hard pellicle B exposures and mix and match pellicle to no pellicle exposures are also presented. The results obtained so far are positive and have not yielded any show stoppers for the use of hard pellicles in production.

Paper Details

Date Published: 28 May 2004
PDF: 10 pages
Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); doi: 10.1117/12.537521
Show Author Affiliations
Michael K. Kocsis, IMEC (Belgium)
Intel Corp. (United States)
Peter De Bisschop, IMEC (Belgium)
Richard Bruls, ASML (Netherlands)
Andrew Grenville, International SEMATECH (United States)
Intel Corp. (United States)
Chris Van Peski, International SEMATECH (United States)


Published in SPIE Proceedings Vol. 5377:
Optical Microlithography XVII
Bruce W. Smith, Editor(s)

© SPIE. Terms of Use
Back to Top