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Proceedings Paper

Mask line monitor: process improvements and yield learning
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Paper Abstract

With ever increasing linewidth challenges per technology changes, the mask manufacturing process becomes more and more difficult. The challenges can be separated into two categories: image size and defects. Mask inspection detects hard defects most likely caused somewhere in the mask manufacturing process. Defect partitioning highlights the hard defects sources. They range from pre-exposure mask blank handling to the cleanliness of the process tools. A test vehicle was designed to allow for mask manufacturing defect partitioning via a die-to-die inspection tool. The process changes implemented range from pre-write mask handling to tool modifications. The methodology used to determine the process induced defects and the yield gains by making the necessary process changes will be presented.

Paper Details

Date Published: 24 May 2004
PDF: 6 pages
Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); doi: 10.1117/12.536773
Show Author Affiliations
Yiyang Jenny Wang, IBM Corp. (United States)
Andrew J Watts, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 5375:
Metrology, Inspection, and Process Control for Microlithography XVIII
Richard M. Silver, Editor(s)

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