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Proceedings Paper

OASIS-based data preparation flows: progress report on containing data size explosion
Author(s): Steffen F. Schulze; Pat LaCour; Laurence Grodd
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Paper Abstract

The ever-increasing complexity of integrated circuits and their enabling process technology has accelerated the increase in data volume of post-RET data which is input to the photomask manufacturing industry. OASIS - the new stream format that has been developed by a working group under the sponsorship of the SEMI Data Path Task Force enables the representation of IC layout data in a much more compact form than GDSII and facilitates the incorporation of hierarchical data into the mask-making infrastructure. OASIS achieves on average a >10x reduction in file size compared to GDSII files and structures the data in a way, which allows a straightforward translation from a hierarchical format to the required flat mask perspective. Owing to the efficiency in representing the data, OASIS files are smaller than commonly used flat exchange formats - like MEBES, thus enabling an efficient hierarchical data flow both from the processing as well as the file handling prospective. The implementation of OASIS into post-tapeout data flows will be discussed and experimental results on OASIS-based data preparation flows will be shown.

Paper Details

Date Published: 3 May 2004
PDF: 9 pages
Proc. SPIE 5379, Design and Process Integration for Microelectronic Manufacturing II, (3 May 2004); doi: 10.1117/12.535683
Show Author Affiliations
Steffen F. Schulze, Mentor Graphics Corp. (United States)
Pat LaCour, Mentor Graphics Corp. (United States)
Laurence Grodd, Mentor Graphics Corp. (United States)

Published in SPIE Proceedings Vol. 5379:
Design and Process Integration for Microelectronic Manufacturing II
Lars W. Liebmann, Editor(s)

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