Share Email Print

Proceedings Paper

A novel wafer baking system using hot air streams
Author(s): Lan Wang; Siew Loong Chow; Ai Poh Loh; Zhi Ming Gong; Woei Wan Tan; Arthur E. B. Tay; Weng Khuen Ho
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper presents a novel wafer baking system that uses hot air streams as heating media and achieves good temperature uniformity across the entire wafer surfaces during the baking process. Wind tunnel experiments have been carried out to verify the concept of using hot air streams for wafer baking. A simple prototyping wafer baking system has been designed and fabricated, and experiments of the baking process have been conducted. Good temperature uniformity across the wafer surface has been achieved. The experimental results match well with the computer fluid dynamics (CFD) simulation results. It is observed that the velocity of the airflow has significant influence on the temperature transient responses. Further optimization of the parameters of the baking system and analytical modelling studies are currently under way.

Paper Details

Date Published: 14 May 2004
PDF: 10 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.534753
Show Author Affiliations
Lan Wang, National Univ. of Singapore (Singapore)
Siew Loong Chow, Singapore Institute of Manufacturing Technology (Singapore)
Ai Poh Loh, National Univ. of Singapore (Singapore)
Zhi Ming Gong, Singapore Institute of Manufacturing Technology (Singapore)
Woei Wan Tan, National Univ. of Singapore (Singapore)
Arthur E. B. Tay, National Univ. of Singapore (Singapore)
Weng Khuen Ho, National Univ. of Singapore (Singapore)

Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?