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Proceedings Paper

Electrical defect SEM review under the various electric circumstances on SAC layer
Author(s): Tae Yong Lee; Nam-Koong Whan; Byoung Ho Lee; Soo-Bok Chin; Do Hyun Cho; Jong Il Choi; Seo Shik Hur; Ki Hwa Ko; Jeong-Ho Yeo
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Paper Abstract

Traditionally the defects, detected by inspection tools (optic & EBI), have been reviewed through DR-SEM or CD-SEM. Nevertheless, when physical defects are characterized using conventional in-line SEM it is hard to re-detect electrical defects because of the restricted working range in e-beam control. To detect and review electrical defects on contact layer EBI tools were used due to the in-line SEM limitation on electrical defect reviews. However the quality of the image was not acceptable to characterize type of defects due to its low resolution (20~30nm). In this article, the review condition of electrical defect was studied under the various electric conditions on Self Align Contact (SAC) layer. In order to achieve the optimum condition, a wide range of negative and positive conditions were applied using acceleration voltage, I-probe current, cap voltage and scan rate. Under stable weak negative charge conditions, 100% review of electrical and contact bottom defects were achieved. Furthermore, we found the high I-probe current and the appropriate acceleration voltage are main factors which increase the capability to re-detect the electrical defect. In this article, we figure out which defect is electrical defect and non-electrical defect applying to diverse electric conditions on the wafer.

Paper Details

Date Published: 24 May 2004
PDF: 6 pages
Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004);
Show Author Affiliations
Tae Yong Lee, Samsung Electronics Co., Ltd. (South Korea)
Nam-Koong Whan, Samsung Electronics Co., Ltd. (South Korea)
Byoung Ho Lee, Samsung Electronics Co., Ltd. (South Korea)
Soo-Bok Chin, Samsung Electronics Co., Ltd (South Korea)
Do Hyun Cho, Samsung Electronics Co., Ltd. (South Korea)
Jong Il Choi, Applied Materials (South Korea)
Seo Shik Hur, Applied Materials (South Korea)
Ki Hwa Ko, Applied Materials (South Korea)
Jeong-Ho Yeo, Applied Materials (Israel)

Published in SPIE Proceedings Vol. 5375:
Metrology, Inspection, and Process Control for Microlithography XVIII
Richard M. Silver, Editor(s)

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