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Proceedings Paper

Mist deposition of thin photoresist films
Author(s): William J. Mahoney III; Paul Roman; Paul Mumbauer; Jerzy Ruzyllo
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Paper Abstract

This experiment is concerned with the development of mist deposition technology as an alternative to spin-on method of photoresist deposition in microelectronic manufacturing. A commercial 200 mm mist deposition tool is used in this study. The results obtained demonstrate effectiveness of mist deposition in resist processing. Basic parameters of resist mist deposition are determined. Deposition rate can be controlled within 10 to 50 nm/min range. Using a stepper and UV-5 photoresist 250 nm patterns were readily defined in 120 nm thick mist deposited resist. It is postulated that mist deposition offers advantages over spin-on process in the case of very thin resist technology as well as in the case of resist deposition on large, non-circular substrates.

Paper Details

Date Published: 14 May 2004
PDF: 6 pages
Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.534149
Show Author Affiliations
William J. Mahoney III, The Pennsylvania State Univ. (United States)
Paul Roman, Primaxx, Inc. (United States)
Paul Mumbauer, Primaxx, Inc. (United States)
Jerzy Ruzyllo, The Pennsylvania State Univ. (United States)

Published in SPIE Proceedings Vol. 5376:
Advances in Resist Technology and Processing XXI
John L. Sturtevant, Editor(s)

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