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Proceedings Paper

Scanning holographic scatterometer for wafer surface inspection
Author(s): Alex Klooster; James Marks; Kael Hanson; Takeo Sawatari
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Paper Abstract

The semiconductor industry requires ever smaller semiconductor structures with faster response times and more function per unit area of each chip. In addition, the industry is changing from 200 mm to 300 mm diameter wafers with fewer defects and rapid detection at all processing stages. To meet these needs, defect data must be processed in near-real-time to expedite correction of processing problems at the earliest possible stage. Under a Small Business Innovation Research (SBIR) program, sponsored by the Air Force Manufacturing Technology Division at Wright Laboratory, Dayton, Ohio, Sentec Corporation has developed a revolutionary technology for contaminant particle detection on unpatterned semiconductor wafers. A key to the Sentec technology is detection, not of the intensity of backscattered energy from particles or defects, but of the amplitude of the electro-magneitc field of this backscattered energy. This new technology will allow the detection of particles that are significantly smaller than those which can be reliably located using current scatterometers. The technical concepts for a stand-alone particle detection tool have been created. It uses a continuous scanning mechanism to perform high-speed examinations of target wafers. This tool, also, has the capability of quantifying the microroughness or background haze of a subject wafer and presenting that information separate from the contamination particle data. During the course of this project, three patent applications were filed.

Paper Details

Date Published: 24 May 2004
PDF: 11 pages
Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); doi: 10.1117/12.533479
Show Author Affiliations
Alex Klooster, Sentec Corp. (United States)
James Marks, Sentec Corp. (United States)
Kael Hanson, Univ. of Wisconsin (United States)
Takeo Sawatari, Sentec Corp. (United States)

Published in SPIE Proceedings Vol. 5375:
Metrology, Inspection, and Process Control for Microlithography XVIII
Richard M. Silver, Editor(s)

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