Share Email Print

Proceedings Paper

Advances in hybrid organic/inorganic optoelectronic integration
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We report on advances in the hybrid organic/inorganic integration of passive and active optical functions. The integration approaches include chip-to-chip attach, flip-chip mounting, and insertion of films in slots formed in planar lightwave circuits. The materials integrated include polymer, silica, silicon, silicon oxynitride, lithium niobate, indium phosphide, gallium arsenide, yttrium iron garnet, and neodymium iron boron. The functions enabled by the hybrid integration approaches span the range of building blocks needed in optical circuitry, while using the highest-performance material system for each function. We demonstrate high-functionality optoelectronic integrated circuits, including fully reconfigurable optical add/drop multiplexers and tunable optical transmitters.

Paper Details

Date Published: 14 June 2004
PDF: 15 pages
Proc. SPIE 5356, Optoelectronic Integrated Circuits VI, (14 June 2004); doi: 10.1117/12.532977
Show Author Affiliations
Louay A. Eldada, DuPont Photonics Technologies (United States)
Antonije M. Radojevic, DuPont Photonics Technologies (United States)
Junichiro Fujita, DuPont Photonics Technologies (United States)
Tomoyuki Izuhara, DuPont Photonics Technologies (United States)
Reinald Gerhardt, DuPont Photonics Technologies (United States)

Published in SPIE Proceedings Vol. 5356:
Optoelectronic Integrated Circuits VI
Louay A. Eldada, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?