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Proceedings Paper

Fabrication of integrated inductors on silicon for fully integrated DC-DC microconverters
Author(s): Ghislain Troussier; Jean-Pierre Laur; Jean-Louis Sanchez; David Bourrier; Veronique Conedera; Monique Dilhan; Norbert Fabre; Yves Lembeye; Herve Morel; Bruno Cogitore
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Paper Abstract

The market of portable instruments is growing more and more. For applications such as computers, cellular phones and microsystems, it is essential to reduce size and weight of electronic devices, including power unit supplies associated with these products. This evolution will require high efficiency on-chip DC-DC converters providing low voltage for the various Ics. Therefore, fabrication of magnetic components dedicated to power conversion becomes necessary. To miniaturize inductors, the micromachining techniques provide solutions based on low-temperature process compatible with active part of the converter. In this paper, a "spiral type" inductor topology designed for power electronics application is investigated. Thick resist molds photolithography and electroplating techniques are used to achieve the copper conductor and the NiFe laminated magnetic core.

Paper Details

Date Published: 30 December 2003
PDF: 8 pages
Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); doi: 10.1117/12.531969
Show Author Affiliations
Ghislain Troussier, LAAS-CNRS (France)
Jean-Pierre Laur, LAAS-CNRS (France)
Jean-Louis Sanchez, LAAS-CNRS (France)
David Bourrier, LAAS-CNRS (France)
Veronique Conedera, LAAS-CNRS (France)
Monique Dilhan, LAAS-CNRS (France)
Norbert Fabre, LAAS-CNRS (France)
Yves Lembeye, ENSIEG (France)
Herve Morel, CEGELY (France)
Bruno Cogitore, Microspire (France)

Published in SPIE Proceedings Vol. 5342:
Micromachining and Microfabrication Process Technology IX
Mary Ann Maher; Jerome F. Jakubczak, Editor(s)

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