The three-dimensional model of the packaging device is established based on ANSYS simulation platform. The thermal properties such as time response, axial and radial temperature distributions at different applied voltages are exhibited. With aids of Real Time Optical Spectrum Analyzing System and IR Camera System, time response of the device and axial temperature distribution along the coated fiber with intracore FBG are both demonstrated. Temperature responses to different applied voltages are achieved after measuring voltage induced wavelength shift and temperature dependent wavelength shift. Simulation shows results in agreement with those of experiment. Finally, regulations on length of the metal coating, size of the package, power consumption and tuning properties of the packaging device are discussed.

Date Published: 18 June 2004
PDF: 5 pages
Proc. SPIE 5349, Physics and Simulation of Optoelectronic Devices XII, (18 June 2004); doi: 10.1117/12.528688

Published in SPIE Proceedings Vol. 5349:
Physics and Simulation of Optoelectronic Devices XII
Marek Osinski; Hiroshi Amano; Fritz Henneberger, Editor(s)