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Burst-mode femtomachining of copper and Lexan (Abstract Only)
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Paper Abstract

Femtosecond ablation of both absorbing and transparent materials has several distinct advantages: the threshold energy fluence for the onset of damage and ablation is orders of magnitude less than for traditional nanosecond laser machining, and by virtue of the rapid material removal of approximately an optical penetration depth per pulse, femtosecond machined cuts can be cleaner and more precise than those made with traditional nanosecond or longer pulse lasers. However, in many materials of interest, especially metals, this limits ablation rates to 10 - 100 nm/pulse. We will present the results of using multiple pulse bursts to significantly increase the per-burst ablation rate compared to a single pulse with the same integrated energy, while keeping the peak intensity of each individual pulse below the air ionization limit. Femtosecond ablation using 850-nm single and eight-pulse 30-ns duration bursts with 4-mJ integrated energy was seen to yield a five-fold increase in the copper ablation rate in ambient air.

Paper Details

Date Published: 10 June 2004
PDF: 2 pages
Proc. SPIE 5273, Laser-Induced Damage in Optical Materials: 2003, (10 June 2004); doi: 10.1117/12.528636
Show Author Affiliations
Craig W. Siders, CREOL/Univ. of Central Florida (United States)
Martin C. Richardson, CREOL/Univ. of Central Florida (United States)

Published in SPIE Proceedings Vol. 5273:
Laser-Induced Damage in Optical Materials: 2003
Gregory J. Exarhos; Arthur H. Guenther; Norbert Kaiser; Keith L. Lewis; M. J. Soileau; Christopher J. Stolz, Editor(s)

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