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Proceedings Paper

Small devices in SOI: fabrication and design issues
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Paper Abstract

There is a trend in photonic circuits to move to smaller device dimensions for improved cost efficiency and device performance. However, the trend also comes at some cost to performance, notably in the polarisation dependence of the circuits, the difficulty in coupling to the circuits, and in some cases, in increased device complexity. This paper discusses a range of Silicon-on-Insulator (SOI) based optical devices, and the advantages and disadvantages in moving to smaller waveguide dimensions. In particular optical phase modulators based upon the plasma dispersion effect and ring resonators are considered, together with a device for coupling to small waveguides, the so-called Dual Grating Assisted Directional Coupler (DGADC). The advantages of moving to small dimensions are considered, and some preliminary experimental results are given. In particular, progress of the DGADC is evaluated in the light of promising experimental results.

Paper Details

Date Published: 1 July 2004
PDF: 12 pages
Proc. SPIE 5357, Optoelectronic Integration on Silicon, (1 July 2004); doi: 10.1117/12.527422
Show Author Affiliations
Graham T. Reed, Univ. of Surrey (United Kingdom)
Goran Z. Masanovic, Univ. of Surrey (United Kingdom)
William Robert Headley, Univ. of Surrey (United Kingdom)
Ching Eng Png, Univ. of Surrey (United Kingdom)
Seong Phun Chan, Univ. of Surrey (United Kingdom)
Soon T. Lim, Univ. of Surrey (United Kingdom)
Vittorio M. N. Passaro, Politecnico di Bari (Italy)
D. Hak, Intel Corp. (Israel)
Oded Cohen, Intel Corp. (Israel)
Mario J. Paniccia, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 5357:
Optoelectronic Integration on Silicon
David J. Robbins; Ghassan E. Jabbour, Editor(s)

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