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Proceedings Paper

Progress toward the development of manufacturable integrated optical data buses
Author(s): Nick Pugliano; Nancy Chiarroto; John Fisher; Noel Heiks; Tuan Ho; Garo Khanarian; Matthew Moynihan; Nathan Pawlowski; Jim Shelnut; David Sherrer; Bruno Sicard; Hai-Bin Zheng
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Paper Abstract

The drive to faster data transmission speeds, more integration, smaller form factors and higher signal integrity all favor the eventual adoption of optical transmission schemes in data buses. This contribution will discuss emerging technologies from Shipley Company, LLC to address the needs of optoelectronic signal transmission. In particular, the discussion will focus on materials and processes that are in development to function within existing printed circuit board (PCB) & microelectronic manufacturing schemes. One topic that is described in detail involves photo-patternable, polymer interconnect technologies. Another topic describes progress in Shipley’s ability to integrate these interconnects into prototypical PCB processes. Progress in connecting the planar waveguides to connectorization schemes will be also be described. Other topics include lithographic and patterning metrics, optical characteristics of interconnects, morphological features of patterned waveguides, integration and coupling considerations, thermal and mechanical properties of the system and general assembly processes..

Paper Details

Date Published: 10 June 2004
PDF: 9 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.526879
Show Author Affiliations
Nick Pugliano, Shipley Co. LCC (United States)
Nancy Chiarroto, Shipley Co. LCC (United States)
John Fisher, Shipley Blacksburg-Optoelectronics Div. (United States)
Noel Heiks, Shipley Blacksburg-Optoelectronics Div. (United States)
Tuan Ho, Shipley Co. LCC (United States)
Garo Khanarian, Rohm and Haas Technical Ctr. (United States)
Matthew Moynihan, Shipley Co. LCC (United States)
Nathan Pawlowski, Shipley Co. LCC (United States)
Jim Shelnut, Shipley Co. LCC (United States)
David Sherrer, Shipley Blacksburg-Optoelectronics Div. (United States)
Bruno Sicard, Shipley Co. LCC (United States)
Hai-Bin Zheng, Shipley Co. LCC (United States)

Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)

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