The drive to faster data transmission speeds, more integration, smaller form factors and higher signal integrity all favor the eventual adoption of optical transmission schemes in data buses. This contribution will discuss emerging technologies from Shipley Company, LLC to address the needs of optoelectronic signal transmission. In particular, the discussion will focus on materials and processes that are in development to function within existing printed circuit board (PCB) & microelectronic manufacturing schemes. One topic that is described in detail involves photo-patternable, polymer interconnect technologies. Another topic describes progress in Shipley’s ability to integrate these interconnects into prototypical PCB processes. Progress in connecting the planar waveguides to connectorization schemes will be also be described. Other topics include lithographic and patterning metrics, optical characteristics of interconnects, morphological features of patterned waveguides, integration and coupling considerations, thermal and mechanical properties of the system and general assembly processes..

Date Published: 10 June 2004
PDF: 9 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.526879

Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)