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Proceedings Paper

Hybrid integration of optical modules for planar deflector switches
Author(s): Alexei L. Glebov; Michael Peters; James Roman; David Kudzuma; Kuo-Chuan Liu; Michael Lee; Kishio Yokouchi
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Paper Abstract

Nonblocking crossconnect photonic switches based on light beam deflection require planar optical modules with hybrid integration of active deflector chips. In this work we present optical modules with two dimensional silica microlens arrays and slab waveguides fabricated on silicon substrates. The 1.55 μm light is launched in the input microlens array, which collimates parallel beams propagating along the module. The slab waveguide vertically confines the light. The output microlenses focus the beams laterally into output fibers. Two chips are inserted in the light path after the input microlens and before the output microlens arrays. The input and output microlenses allow propagation of the light beams through modules up to 100 mm long with a beam width of less than 400 μm. A hybrid integration process flow is developed to place the deflector chips in the light path with high alignment accuracy. The chips are flip-chip bonded to the substrate with submicron accuracy in the vertical positioning. Various contributions can lead to the chip displacements such as, for example, standoff island height variations, aligner tolerances, substrate bow, etc. Experiments are conducted to evaluate the effect of chip displacement on the insertion losses of the hybrid-integrated modules. 100-mm long optical modules with input and output chips are fabricated with less than 4 dB insertion losses. The analysis of loss contributions and possibilities for improvements are discussed.

Paper Details

Date Published: 10 June 2004
PDF: 9 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.524931
Show Author Affiliations
Alexei L. Glebov, Fujitsu Labs. of America, Inc. (United States)
Michael Peters, Fujitsu Labs. of America, Inc. (United States)
James Roman, Fujitsu Labs. of America, Inc. (United States)
David Kudzuma, Fujitsu Labs. of America, Inc. (United States)
Kuo-Chuan Liu, Fujitsu Labs. of America, Inc. (United States)
Michael Lee, Fujitsu Labs. of America, Inc. (United States)
Kishio Yokouchi, Fujitsu Labs. of America, Inc. (United States)

Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)

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