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Proceedings Paper

Novel process for realization of multiple-axis actuators suitable for the realization of an optical switch
Author(s): Marco Del Sarto; Simone Sassolini; Mauro Marchi; Lorenzo Baldo
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Paper Abstract

This paper illustrates a novel MEMS technology that allows the creation of a multiple axis actuator / sensor trough deep silicon etching and wafer bonding techniques. As example a dual axis rotational high-stroke MEMS actuator is presented. This device can integrate a mirror to realize a device used, for example, in fully optical multiplexer. Microfabrication technology derives from our previous works and it’s based on deep silicon trench techniques as well as on wafer bonding capabilities. More over the resulting assembly after the wafer bonding is machined to proceed on realizing the complete MEMS device.

Paper Details

Date Published: 30 December 2003
PDF: 9 pages
Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); doi: 10.1117/12.524722
Show Author Affiliations
Marco Del Sarto, STMicroelectronics (Italy)
Simone Sassolini, STMicroelectronics (Italy)
Mauro Marchi, STMicroelectronics (Italy)
Lorenzo Baldo, STMicroelectronics (Italy)

Published in SPIE Proceedings Vol. 5342:
Micromachining and Microfabrication Process Technology IX
Mary Ann Maher; Jerome F. Jakubczak, Editor(s)

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