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Proceedings Paper

Three-dimensional photolithography based on image reversal
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Paper Abstract

In this paper we present a novel fabrication method for the realization of complex 3D multi-layer structures with commercially available photoresists. This method is based on the observation that during an image-reversal process, the post exposure bake (PEB) that is used to reverse the contrast of the exposed pattern reduces the sensitivity of the unexposed photoresist at the same time. In multi-layer lithography, this phenomenon, along with non-uniformly distributed dose can be exploited to eliminate the re-patterning effect of the subsequent exposures and thus makes suspended 3D structures possible. In this presentation we demonstrate this observation experimentally, and fabricate “woodpile” structures (≥ 3 layers) using the proposed method.

Paper Details

Date Published: 30 December 2003
PDF: 8 pages
Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); doi: 10.1117/12.524654
Show Author Affiliations
Peng Yao, Univ. of Delaware (United States)
Garrett Schneider, Univ. of Delaware (United States)
Binglin Miao, Univ. of Delaware (United States)
Janusz Murakowski, Univ. of Delaware (United States)
Dennis Prather, Univ. of Delaware (United States)

Published in SPIE Proceedings Vol. 5342:
Micromachining and Microfabrication Process Technology IX
Mary Ann Maher; Jerome F. Jakubczak, Editor(s)

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