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Proceedings Paper

Packaging considerations for reliability of electrically controlled MEMS VOA
Author(s): Yeong Gyu Lee; Seok Kee Hong; Moo Youn Park; Sung Cheon Jung; Seong Hun Lee
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Paper Abstract

Unlike other Micro Electro Mechanical System (MEMS) type devices packaging, MEMS type optical devices require higher standard of packaging technique and careful material selection than any other MEMS type products. A number of attempts and a lot of efforts have been devoted to achieve a reliable MEMS type optical device. In this paper, we have achieved highly reliable MEMS type variable optical attenuator (VOA), which passed the Telcordia reliability standard for optical components, by our advanced packaging process and careful reliability considerations in the initial product design step. Our advanced packaging process includes, ultra fine optical fibre alignment on the MEMS chip, securing the aligned optical fibre and hermetic sealing technique. This paper will discuss above advanced packaging issues in detail and reliability test result of the device fabricated according to the developed packaging method.

Paper Details

Date Published: 24 January 2004
PDF: 6 pages
Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004); doi: 10.1117/12.524603
Show Author Affiliations
Yeong Gyu Lee, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Seok Kee Hong, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Moo Youn Park, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Sung Cheon Jung, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Seong Hun Lee, Samsung Electro-Mechanics Co., Ltd. (South Korea)

Published in SPIE Proceedings Vol. 5346:
MOEMS and Miniaturized Systems IV
Ayman El-Fatatry, Editor(s)

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