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Proceedings Paper

Innovative metrology method for the 3-dimensional measurement of MEMS structures
Author(s): Shay Wolfling; David Banitt; Nissim Ben-Yosef; Yoel Arieli
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Paper Abstract

We introduce and demonstrate a new metrology method applicable for 3-dimensional (3D) measurements, based on common-path phase-shift interferometry. The method includes a unique optical setup in which wavefront modifications are applied over spatial regions of the wavefront reflected from an inspected object, and proprietary algorithm is used to fully reconstruct the reflected wavefront and thus the sample topography and reflectivity. This 3D measurement method was implemented into a measurement system, consisting of a measurement head integrated with a white-light microscope, using the latter as its imaging system. The system has sub nano-meter Z-axis accuracy, independent of the optical magnification. Other advantages of the technique are rapid real-time data acquisition, immunity to noise and vibration, small size, no moving parts, ability to work in various lateral magnifications, and versatile (reflectance or transmittance) optical imaging. The system’s small footprint, insensitivity to vibrations and operation simplicity, make it suitable to measure MEMS components in production environments and in conjunction with other probing systems.

Paper Details

Date Published: 23 December 2003
PDF: 9 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.524395
Show Author Affiliations
Shay Wolfling, Nano-Or Technologies (Israel)
Hebrew Univ. of Jerusalem (Israel)
David Banitt, Nano-Or Technologies (Israel)
Nissim Ben-Yosef, Hebrew Univ. of Jerusalem (Israel)
Yoel Arieli, Nano-Or Technologies (Israel)
Jerusalem College of Technology (Israel)

Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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