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Proceedings Paper

Multifunctional interferometric platform for on-chip testing of the micromechanical properties of MEMS/MOEMS
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Paper Abstract

We have developed a multifunctional interferometric platform for testing MEMS/MOEMS, measuring the 3-D out-of-plane deflections and providing both material properties and motion behaviour of microdevices. Specific metrology procedures have been demonstrated to determine respectively and residual stress of silicon membranes compressively prestressed by SiOxNy PECVD deposition study of vibration modes of PZT microactuators as well as the expertise of Scratch Drive Actuators.

Paper Details

Date Published: 23 December 2003
PDF: 7 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003);
Show Author Affiliations
Christophe Gorecki, Univ. de Franche-Comte (France)
Michal Jozwik, Warsaw Univ. of Technology (Poland)
Leszek A. Salbut, Warsaw Univ. of Technology (Poland)

Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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