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Proceedings Paper

A novel bistable thermally actuated snap-through actuator for out-of-plane deflection
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Paper Abstract

In this paper , the importance of boundary conditions for two- way bistable thermal snapping action is analysed by Ansys simulations. Several designs are developed and modified into a novel bistable actuator for out of plane deflection. It consists of 4 long epi-silicon single layered legs , a 1200um x 40um x 3um microbeam and 4 spring-supports in which both are polysilicon/oxide/episilicon layered. Buckling of the released structure is achieved by the compressive residual stress remaining in the oxide layer as a result of the processing. The structure switches between two stable equilibrium states by heating the legs and then heating one of the polysilicon layers to produce the thermal moment needed for snapping to occur, hence achieving two-way bistable operation.

Paper Details

Date Published: 2 April 2004
PDF: 9 pages
Proc. SPIE 5276, Device and Process Technologies for MEMS, Microelectronics, and Photonics III, (2 April 2004); doi: 10.1117/12.523272
Show Author Affiliations
Kevin Yu, Univ. of New South Wales (Australia)
Aron Michael, Univ. of New South Wales (Australia)
Chee Yee Kwok, Univ. of New South Wales (Australia)

Published in SPIE Proceedings Vol. 5276:
Device and Process Technologies for MEMS, Microelectronics, and Photonics III
Jung-Chih Chiao; Alex J. Hariz; David N. Jamieson; Giacinta Parish; Vijay K. Varadan, Editor(s)

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