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Proceedings Paper

Automated packaging platform for low-cost high-performance optical components manufacturing
Author(s): Robert T. Ku
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Paper Abstract

Delivering high performance integrated optical components at low cost is critical to the continuing recovery and growth of the optical communications industry. In today's market, network equipment vendors need to provide their customers with new solutions that reduce operating expenses and enable new revenue generating IP services. They must depend on the availability of highly integrated optical modules exhibiting high performance, small package size, low power consumption, and most importantly, low cost. The cost of typical optical system hardware is dominated by linecards that are in turn cost-dominated by transmitters and receivers or transceivers and transponders. Cost effective packaging of optical components in these small size modules is becoming the biggest challenge to be addressed. For many traditional component suppliers in our industry, the combination of small size, high performance, and low cost appears to be in conflict and not feasible with conventional product design concepts and labor intensive manual assembly and test. With the advent of photonic integration, there are a variety of materials, optics, substrates, active/passive devices, and mechanical/RF piece parts to manage in manufacturing to achieve high performance at low cost. The use of automation has been demonstrated to surpass manual operation in cost (even with very low labor cost) as well as product uniformity and quality. In this paper, we will discuss the value of using an automated packaging platform.for the assembly and test of high performance active components, such as 2.5Gb/s and 10 Gb/s sources and receivers. Low cost, high performance manufacturing can best be achieved by leveraging a flexible packaging platform to address a multitude of laser and detector devices, integration of electronics and handle various package bodies and fiber configurations. This paper describes the operation and results of working robotic assemblers in the manufacture of a Laser Optical Subassembly (LOS), its subsequent automated testing and burn/in process; and the placement of the LOS into a package body and hermetically sealing the package. The LOS and Package automated assembler robots have achieved a metrics of less than 1 um accuracy and 0.1 um resolution. The paper also discusses a method for the critical alignment of a single-mode fiber as the last step of the manufacturing process. This approach is in contrast to the conventional manual assembly where sub-micron fiber alignment and fixation steps are performed much earlier during the assembly process. Finally the paper discusses the value of this automated platform manufacturing approach as a key enabler for low cost small form factor optical components for the new XFP MSA class of transceiver modules.

Paper Details

Date Published: 12 May 2004
PDF: 5 pages
Proc. SPIE 5280, Materials, Active Devices, and Optical Amplifiers, (12 May 2004); doi: 10.1117/12.522348
Show Author Affiliations
Robert T. Ku, CyOptics (United States)

Published in SPIE Proceedings Vol. 5280:
Materials, Active Devices, and Optical Amplifiers
Connie J. Chang-Hasnain; Dexiu Huang; Yoshiaki Nakano; Xiaomin Ren, Editor(s)

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