Proceedings Paper
Optimization of chrome dry etch in Tetra II using asymmetrically loaded patterns| Format | Member Price | Non-Member Price |
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| $17.00 | $21.00 |
Paper Abstract
Asymmetrically loaded patterns have been used to develop and optimize the chrome etch process on the TetraO II, the next -generation tool offered by Etec Systems. These asymmetrically loaded patterns offer unique challenges to the dry etch process by concentrating much of the chrome load in one section of the mask (usually one quadrant) while leaving the rest of the mask uniformly loaded. Numerical analysis of both the final chrome and the point-by-point etch
contribution has been implemented to allow accurate interpretation of etch results.
Paper Details
Date Published: 17 December 2003
PDF: 9 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.519625
Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)
PDF: 9 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.519625
Show Author Affiliations
Cynthia B. Brooks, Applied Materials, Inc. (United States)
Rex B. Anderson III, Applied Materials, Inc. (United States)
Jason O. Clevenger, Applied Materials, Inc. (United States)
Corey Collard, Applied Materials, Inc. (United States)
Rex B. Anderson III, Applied Materials, Inc. (United States)
Jason O. Clevenger, Applied Materials, Inc. (United States)
Corey Collard, Applied Materials, Inc. (United States)
Monika Halim, Applied Materials, Inc. (United States)
Turgut Sahin, Applied Materials, Inc. (United States)
Alfred W. Mak, Applied Materials, Inc. (United States)
Turgut Sahin, Applied Materials, Inc. (United States)
Alfred W. Mak, Applied Materials, Inc. (United States)
Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)
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