Proceedings Paper
Plasma and flow modeling of photomask etch chambers| Format | Member Price | Non-Member Price |
|---|---|---|
| $17.00 | $21.00 |
Paper Abstract
The uniformity of critical dimensions is an important aspect of photomask fabrication, and the etch process can be improved by optimizing the geometry of the focus ring that surrounds the mask. Previous experimental results have shown that the focus ring can have a dramatic impact on the variability of critical dimensions on the photomask. Simulations were performed with the Hybrid Plasma Equipment Model (HPEM) software to examine the impact of different focus ring geometries on the plasma characteristics and improve the understanding of the experimental data.
Paper Details
Date Published: 17 December 2003
PDF: 11 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518200
Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)
PDF: 11 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518200
Show Author Affiliations
Edward Hammond, Etec Systems, Inc., an Applied Materials Co. (United States)
Jason O. Clevenger, Etec Systems, Inc., an Applied Materials Co. (United States)
Jason O. Clevenger, Etec Systems, Inc., an Applied Materials Co. (United States)
Melisa J. Buie, Etec Systems, Inc., an Applied Materials Co. (United States)
Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)
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