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Proceedings Paper

Inspecting alternating phase shift masks by matching stepper conditions
Author(s): Shirley Hemar; Anja Rosenbusch
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Paper Abstract

The paper presents a new technology to inspect alternating phase shifting masks. Instead of finding defects based on a size-dependent defect specification, defects are found according to their impact at the wafer CD result. The inspection methodology used is aerial imaging. Phase effects are taking into account inherently. The main advantage of this method is that only defects, which actually affect the wafer result, will be detected and classified. The paper presents first inspection results on alternating phase shifting test masks designed for the 70nm generation.

Paper Details

Date Published: 28 May 2003
PDF: 6 pages
Proc. SPIE 5148, 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (28 May 2003); doi: 10.1117/12.515103
Show Author Affiliations
Shirley Hemar, Etec Systems, Inc., An Applied Materials Co. (Israel)
Anja Rosenbusch, Etec Systems, Inc., An Applied Materials Co. (United States)


Published in SPIE Proceedings Vol. 5148:
19th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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