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Proceedings Paper

Extending TeraStar reticle inspection capability to the 90-nm node through layer-specific algorithms
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Paper Abstract

Sub-wavelength lithography used for 9Onm node devices requires new approaches to both lithography processes and reticle design. Reticle complexity has increased as OPC and Phase Shift techniques are used to improve lithography process windows at smaller design rules. This paper will discuss the results of algorithms developed for specific layers to extend the TeraStar reticle inspection tool to 9Onm reticle research and development applications. Lithographically challenging layers have been the focus of the algorithm development programs, specifically gate layers and contact/via layers. Alternating phase shift masks are gaining importance as a reticle enhancement technique to meet the ITRS Litho Roadmap 9Onm node line widths. A new class of TeraPhase algorithms has been developed for alternating phase shift mask inspection with a focus on gate layers. Die-to-die and die-to-database inspection results will be presented for alternating phase shift programmed defect test plates and production gate layers. Contact and via layer reticles are some of the most difficult layers for CD and lithography process window control. A new family of TeraFlux algorithms has been developed based on flux energy differences between contacts to significantly improve sensitivity to lithographically significant CD errors. Die-to-die and die-to-database inspection results will be presented for contact programmed defect test plates and production contact and via layers. Comparisons of the newly developed algorithms will be made to previous generation inspection capability.

Paper Details

Date Published: 28 May 2003
PDF: 9 pages
Proc. SPIE 5148, 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (28 May 2003); doi: 10.1117/12.515100
Show Author Affiliations
Maciej W. Rudzinski, KLA-Tencor Corp. (United States)
Hector I. Garcia, KLA-Tencor Corp. (United States)
William Waters Volk, KLA-Tencor Corp. (United States)
Lantian Wang, KLA-Tencor Corp. (United States)


Published in SPIE Proceedings Vol. 5148:
19th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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