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Proceedings Paper

Effects of adhesive on the electromechanical response of a piezoceramic-transducer-coupled smart system
Author(s): C. W. Ong; Yaowen Yang; Y. T. Wong; Suresh Bhalla; Yong Lu; Chee Kiong Soh
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Paper Abstract

The electro-mechanical (EM) impedance method is gradually emerging as a widely accepted technique for structural health monitoring and systems identification. The method utilizes smart piezoceramic (PZT) transducers intimately bonded to the surface of a structural substrate. Through the unique electro-mechanical properties of the PZT transducers, the presence of damage, as well as the dynamical properties of the host structure are captured and reflected in the electrical admittance response. In the present work, the effect of the bond layer on the electro-mechanical response of a smart system is being studied. Experiments with the EM impedance method were performed on laboratory-sized beams. Consequently, the effects of shear lag due to the finite thickness bond layer were successfully identified. This was followed by the theoretical analysis of shear lag effects. It was found that the induced strain behavior of the structural specimen in question is inevitably modified by the presence of shear lag between the PZT transducer and the structural substrate. Subsequently, the EM admittance response of the beam specimens were simulated based on the results gathered from the theoretical analysis. Incidentally, it was found that the theoretical model clearly depicts the trends of the measured response.

Paper Details

Date Published: 14 October 2003
PDF: 7 pages
Proc. SPIE 5062, Smart Materials, Structures, and Systems, (14 October 2003); doi: 10.1117/12.514757
Show Author Affiliations
C. W. Ong, Nanyang Technological Univ. (Singapore)
Yaowen Yang, Nanyang Technological Univ. (Singapore)
Y. T. Wong, Nanyang Technological Univ. (Singapore)
Suresh Bhalla, Nanyang Technological Univ. (Singapore)
Yong Lu, Nanyang Technological Univ. (Singapore)
Chee Kiong Soh, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 5062:
Smart Materials, Structures, and Systems
S. Mohan; B. Dattaguru; S. Gopalakrishnan, Editor(s)

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