
Proceedings Paper
Three-dimensional nanoprofiling of semiconductor surfacesFormat | Member Price | Non-Member Price |
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Paper Abstract
The qualification of semiconductor surfaces is an important aspect of IC lechnology, from checking the quality of the
substrate material right through to the dimensioning of the finished device. Etching the surface of the substrate reveals details
concerning chemical and crystal defects. Surface roughness measurements are required before preparing epitaxial layers and
device processing. The height, width and shape of component features need to be checked throughout the device processing
stage.
In this paper we describe a three dimensional NDT optical profiler we have developed for the nanometrology of
semiconductor surfaces. The system is based on interference microscopy, using phase stepping for automatic fringe analysis.
Illumination is by high intensity LED or white light and detection is by a CCD camera. A vertical resolution of mm is
achieved, with the lateral resolution being better than O.5i.m. Comparison of a two dimensional profile of a chemically
etched surface using PSM with that obtained by a stylus profiler are within 10% agreement.
Results are shown of three dimensional profiles of chemically etched InP and an MOCVD grown epitaxial layer, surface
roughness of polished InP, and profiles of a recess in a combined laser/photodiode device.
Paper Details
Date Published: 1 January 1991
PDF: 10 pages
Proc. SPIE 1332, Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection, (1 January 1991); doi: 10.1117/12.51100
Published in SPIE Proceedings Vol. 1332:
Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection
Chander Prakash Grover, Editor(s)
PDF: 10 pages
Proc. SPIE 1332, Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection, (1 January 1991); doi: 10.1117/12.51100
Show Author Affiliations
Paul C. Montgomery, Univ. des Sciences et Techniques du Languedoc (France)
Jean-Pierre Fillard, Univ. des Sciences et Techniques du Languedoc (France)
Jean-Pierre Fillard, Univ. des Sciences et Techniques du Languedoc (France)
N. Tchandjou, Univ. des Sciences et Techniques du Languedoc (France)
Syamsa Moh Ardisasmita, Univ. des Sciences et Techniques du Languedoc (Indonesia)
Syamsa Moh Ardisasmita, Univ. des Sciences et Techniques du Languedoc (Indonesia)
Published in SPIE Proceedings Vol. 1332:
Optical Testing and Metrology III: Recent Advances in Industrial Optical Inspection
Chander Prakash Grover, Editor(s)
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