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Proceedings Paper

Laser-induced gold deposition for thin-film circuit repair
Author(s): Thomas H. Baum; Paul B. Comita; Toivo T. Kodas
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Paper Abstract

Laser chemical vapor deposition (LCVD) of gold has been used to repair 'open' defect on high-end multi-chip packaging modules. The ability to repair metallurgical features of less than 25 micrometers width was readily accomplished and electrical resistances are comparable to resistances of unrepaired nets of identical geometry. The reliability of LCVD repairs was monitored after thermal processing, T&H and electrical stressing. The ability to repair 'open' defects in the thin-film redistribution (TFR) layer of the module has facilitated testing of designs early in the development process.

Paper Details

Date Published: 1 December 1991
PDF: 10 pages
Proc. SPIE 1598, Lasers in Microelectronic Manufacturing, (1 December 1991); doi: 10.1117/12.51033
Show Author Affiliations
Thomas H. Baum, IBM/Almaden Research Ctr. (United States)
Paul B. Comita, IBM/Almaden Research Ctr. (United States)
Toivo T. Kodas, Univ. of New Mexico (United States)

Published in SPIE Proceedings Vol. 1598:
Lasers in Microelectronic Manufacturing
Bodil Braren, Editor(s)

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