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Proceedings Paper

Unframed via interconnection of nonplanar device structures
Author(s): Manjin J. Kim
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Paper Abstract

Multilevel metallization is an indispensable requirement for dense VLSI or ULSI because each additional level can significantly reduce the chip size. Multi-device integration is another trend for higher on-chip performance in which many different device structures, including non-planar trench structures, are fabricated from different material.

Paper Details

Date Published: 1 December 1991
PDF: 11 pages
Proc. SPIE 1596, Metallization: Performance and Reliability Issues for VLSI and ULSI, (1 December 1991); doi: 10.1117/12.51007
Show Author Affiliations
Manjin J. Kim, Philips Labs. (United States)

Published in SPIE Proceedings Vol. 1596:
Metallization: Performance and Reliability Issues for VLSI and ULSI
Gennady Sh. Gildenblat; Gary P. Schwartz, Editor(s)

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